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1. Thermal curing of epoxy resins at lower temperature using 4‐(methylamino)pyridine derivatives as novel thermal latent curing agents 2. Rational design of a room‐temperature curing method, based on the epoxy–thiol click reaction, for UV‐curable hard coatings with ultrahigh strength and adhesion *Among work published in Journal of Polymer Science between January 1, 2024 - December 31, 2024, view count taken at 12 months after publication.
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